HPE BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years. The enclosure is 10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared 7.1 Tbps high-speed NonStop mid-plane for wire-once connectivity of server blades to network and shared storage. Power is delivered through a pooled-power backplane, and power input flexibility is provided with choices of single-phase AC input, 3-phase AC input, -48V DC input, and high voltage DC input.
Table 1 show you the main specification of the BladeSystem c7000.
|
Feature |
Description |
|
System fan features |
Hot plug redundant standard |
|
Form factor |
10U |
|
BladeSystem supported |
Yes |
|
Management features |
Redundant Onboard Administrator - LAN and serial access |
|
Dimensions |
Height: 17.4 in (442 mm) Width: 17.6 in (447.04 mm) Depth: 32 in (813 mm) |
Table 2 show you the main models of the ML150 servers.
|
Model |
Description |
|
HP BLc7000 1PH 2PS 4Fan Trl IC Plat Encl |
|
|
HP BLc7000 1PH 6PS 10Fan 16 IC Plat Encl |
|
|
HP BLc7000 CTO 3 IN LCD Plat Enclosure |
|
|
HP BLc7000 1PH 6PS 10Fan 16 OV Plat Encl |